Flexible Electronics Materials

The Science Partner Journal Research is now considering submissions for a special issue on Flexible Electronics Materials.


Recent advances in flexible, printed, or dissolvable thin films or organic/hybrid electronic devices.


    Xiaogang Liu

    Associate Editor, Research

    Department of Chemistry, National University of Singapore

      Submission Deadline

      December 31, 2021

        Submission Instructions

        Please indicate in your cover letter that your submission is intended for inclusion in the Flexible Electronics Materials special issue.