Skip to main content

Research Article

Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion

L. Wu1, Z. Dong2, H. Du3, C. Li2, N. X. Fang3,*, and Y. Song1,*

1Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Zhongguancun North First Street 2,100190 Beijing, China
2CAS Key Laboratory of Bio-inspired Materials and Interfacial Sciences, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China
3Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
*Corresponding author(s) email(s): ude.tim@gnafcin and nc.ca.sacci@gnosly

How to Cite this Article

L. Wu, Z. Dong, H. Du, C. Li, N. X. Fang, and Y. Song, “Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion,” Research, vol. 2018, Article ID 4795604, 10 pages, 2018. https://doi.org/10.1155/2018/4795604.